| 发明名称 |
BOND COMPOSITION FOR GRINDING TIP, AND GRINDING TIP AND WHEEL USING THE SAME |
| 摘要 |
PURPOSE: A bond composition for a grinding tip is provided to improve the life and grinding performance of the grinding tip by properly mixing tin and antimony. CONSTITUTION: In a bond composition, the bond composition for a grinding tip is composed of 60-90 weight percent tin, and 40-10 weight percent antimony.
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| 申请公布号 |
KR20030056482(A) |
申请公布日期 |
2003.07.04 |
| 申请号 |
KR20010086699 |
申请日期 |
2001.12.28 |
| 申请人 |
EHWA DIAMOND IND. CO., LTD. |
发明人 |
PARK, HUI DONG;PARK, JONG GUK |
| 分类号 |
B24D3/00;(IPC1-7):B24D3/00 |
主分类号 |
B24D3/00 |
| 代理机构 |
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代理人 |
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