发明名称 TRIMMING ELEMENT, SEMICONDUCTOR DEVICE AND ITS FABRICATING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a highly reliable trimming element being mounted on a semiconductor integrated circuit in which a fuse can be blown out stably and easily. SOLUTION: A fuse Fa comprising a conductive film more fusible than polysilicon, e.g. a conductive film 27 containing Ge, is formed on a semiconductor substrate 31 through an insulating film 32 thus constituting a trimming element 22. Alternatively, the trimming element is constituted of primary and secondary inductance elements generating electromagnetic induction, and a fuse. Alternatively, a fuse having a pn junction at the cutting position is formed thus constituting the trimming element. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003188258(A) 申请公布日期 2003.07.04
申请号 JP20010386599 申请日期 2001.12.19
申请人 SONY CORP 发明人 MORI HIDEKI;ASAMI KENJI
分类号 H01L21/331;H01L21/82;H01L21/822;H01L21/8222;H01L27/04;H01L27/06;H01L29/737;(IPC1-7):H01L21/82 主分类号 H01L21/331
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