发明名称 MONOLITHIC HIGH-FREQUENCY INTEGRATED CIRCUIT STRUCTURE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a passive part, an ESD part and a logic part with a monolithic integration as a high-frequency power transistor structure with high cost efficiency and reliability. SOLUTION: A high-frequency power FET device 22 forms a monolithic high-frequency integrated circuit structure 10 by integrating the passive parts 23, 24, 26, 28, 31, electric static discharge (ESD) devices 27, 127, 227, and/or a logic structure 29 together on a semiconductor body 13. The high-frequency power FET device 22 includes a source grounding structure. The logic structure 29 uses the high-frequency power FET structure of the source grounding structure as one of the devices of a CMOS constitution. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003188272(A) 申请公布日期 2003.07.04
申请号 JP20020337509 申请日期 2002.11.21
申请人 MOTOROLA INC 发明人 COSTA JULIO C;BURGER WAYNE R;CAMILLERI NATALINO;DRAGON CHRISTOPHER P;LAMEY DANIEL J;LOVELACE DAVID K;NGO DAVID Q
分类号 H01F17/00;H01L21/822;H01L21/8234;H01L27/02;H01L27/04;H01L27/06;H01L27/088;H01L29/10;H01L29/417;H01L29/78;(IPC1-7):H01L21/823 主分类号 H01F17/00
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