| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that in order not to bulge an adhesive paste from the outside of a component when the component is mounted on a substrate or the like via the paste, a method for controlling the pressure for pressing the component to the paste or controlling the height of the component from the surface of the substrate is conducted, but these mounting step requires a long time, and an accurate apparatus is needed. SOLUTION: When the component is pressed to the adhesive paste formed on the substrate or the like, the component is observed with a microscope or a TV camera, and the component is released at a time point that the part of the paste is bulged from an exterior of a component planar shape. Then, when the component is left to stand for a predetermined time, the paste is moistened and spread between the component and the substrate by its surface tension. Thereafter, the paste is cured to mount the component in a short time without bulging the paste out of the component. COPYRIGHT: (C)2003,JPO
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