RING BOAT OF FURNACE FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A ring boat of a furnace for manufacturing a semiconductor device is provided to be capable of securing a good uniformity and minimizing the damage due to a heat treatment by using a circular load and a plurality of sub-loads through the improvement of the ring boat structure. CONSTITUTION: A ring boat(2) includes a circular load(4). A circular wafer(1) is loaded and physically supported on the circular load(4), wherein the circular load(4) is exactly located corresponding to the peripheral portion of the circular wafer(1). At this time, heat is transferred to the peripheral portion of the circular wafer(1) through the circular load(4). A plurality of sub-loads are installed at the inner portion of the circular load(4) for transferring the heat to the center portion of the circular wafer.