SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor element, having a bonding pad and its manufacturing method.

SOLUTION: The bonding pad has two conductive films and an intermediate layer inbetween them. The intermediate layer has a hybrid form, which is a mixture of a relatively conductive flat board part and a plug/mesh part. The plug/mesh part has a conductive part which is periodically pierced by non- conductive parts or a non-conductive part which is periodically pierced by conductive parts. The width of the conductive part or the non-conductive part in the plug/mesh part is comparatively smaller than that of the flat board part. The hybrid form keeps appropriate balance between the frat board part, where a probe pin contacts and the plug/mesh part which provides an additional path for electric current.

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