| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for soldering a printed board and for an apparatus for the same in which the solder surely enters a portion of surface mount parts to be soldered to prevent a non-soldered portion in order to solve the problem in a prior art that when a mixed components mounting board is soldered with a primary jet nozzle using a punched plate in which many holes are drilled as in the prior art, there occurs the non-soldering that the solder does not adhere to the portion of the surface mount parts to be soldered. SOLUTION: The apparatus for soldering is adapted as follows. Protrusions of the molten solder formed with a punched plated of a primary jet nozzle become higher in order from an entering side to an outgoing side, and a printed board is brought into contact with these protrusions. Further, a blocking plate adjustable in its height is provided on the outgoing side of the punched plate in the primary jet flow nozzle. COPYRIGHT: (C)2003,JPO |
