| 摘要 |
PROBLEM TO BE SOLVED: To form an electrode of a chip component 12B by an Ni film, to prevent an eutectic alloy from being formed, and to prevent cracks from being formed in an insulating resin when reflow-soldering circuit arrangement 10. SOLUTION: The electrode of a chip component 12B is formed by an Ni film 18. The chip component 12B is mounted on a conductive pattern 11 via solder 15B. In this case, a relatively large amount of flux is contained in the solder 15B to increase solderability in Ni. As a result, the formation of an eutectic alloy where a temperature in solidus is low is prevented, thus preventing damage to the circuit arrangement 10 by cracks in an insulating resin 13 when mounting the circuit arrangement 10 onto a board by reflow-soldering. COPYRIGHT: (C)2003,JPO
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