MULTI-CHIP SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A multi-chip semiconductor package is provided to be capable of vertically connecting the second semiconductor package mounted with the second semiconductor chip in the first semiconductor package mounted with the first semiconductor chip. CONSTITUTION: When vertically connecting the second semiconductor package(20) in the first semiconductor package(10), the second semiconductor chip(21) of the second semiconductor package is vertically connected with a circuit board(11) of the first semiconductor package after mounting the first semiconductor chip(12) on the circuit board. Preferably, the second semiconductor chip is enclosed with a resin molding part(25) and a plurality of wires(23) are connected between the second semiconductor chip and lead frames(24) of the second semiconductor package for transferring an electric signal to the outside.