| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-frequency module wherein its performance is superior, thickness is small, and no breakage occurs in an IC chip. <P>SOLUTION: This high-frequency module is provided with an insulation substrate 1 that is formed by laminating a plurality of ceramic thin sheets 2, and an insulation layer 7 formed on the upper surface of the insulation substrate 1. A wiring pattern 8 formed of a thin film, and a thin-film circuit 10 that is connected with the wiring pattern 8 and comprises an electric part 9 including at least a resistance made of thin film and/or capacitor, are formed on the upper surface of the insulation layer 7. Therefore, electric parts 9 can be formed more accurately than heretofore, resulting in realizing a high-performance module. <P>COPYRIGHT: (C)2003,JPO |
