| 摘要 |
PROBLEM TO BE SOLVED: To prevent ruptures in bump junction in the curing heat treatment of resin, when manufacturing a semiconductor packaging body where two semiconductor integrated circuits in which bumps are formed on the surfaces, are jointed facing, and the clearance is filled with an insulating resin. SOLUTION: In a state where clearance that is generated, by jointing a chip 1 to a chip 4 is filled with a liquid insulating resin 6, heat increase is conducted from a room temperature to 215°C that is lower than the material melting point of 223°C of an Sn/Pb soldering bump 3 formed in a chip 1 by 8°C, and the temperature is maintained, until the insulating resin 6 is cured. Then, heat increase is conducted from a resin-curing temperature 215°C to 260°C, being higher than a material melting point of 223°C of the bump 3 by 37°C is maintained for 1.0 minute. Then, the temperature is decreased from 260°C to normal temperature 25°C (11), and the curing process of the filled insulating resin is completed. COPYRIGHT: (C)2003,JPO
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