| 摘要 |
PURPOSE: A wafer drying equipment is provided to be capable of preventing an oxide layer from being generated on the surface of a wafer while carrying out a drying process by basically blocking the contact of oxygen at the surface of the wafer by using a sealing part. CONSTITUTION: A wafer drying equipment(100) is provided with a processing bath(112) for loading a wafer guide(120), a cover(114), a jet port for jetting dry gas into the processing bath, a pressure decreasing part for reducing the pressure of the processing bath, and an exhaust pipe(172) for exhausting remaining gas containing the jetted dry gas and vapor. Preferably, the exhaust pipe is connected through a water exhaust pipe. Preferably, the water exhaust pipe includes the first and second water exhaust pipe(152a,152b). Preferably, a sealing part made of an O-ring(116) is installed between the cover and the processing bath.
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