| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer polishing apparatus which can prevent a wafer from having cross contamination. <P>SOLUTION: A washing liquid jet hole 80 is formed in a wafer holding head 14. A surface plate washing nozzle 84 is arranged adjacently to the wafer holding head 14. After a wafer polishing process, washing liquid 82 is supplied from the washing liquid jet hole 60 to polishing cloth 16 and jetted from the surface plate washing nozzle 84 to the polishing cloth 16. At this time, a polishing surface plate 12 is rotating and the washing liquid 82 jetted from the washing liquid jet hole 80 and surface plate washing nozzle 84 enters between a wafer 54 and the polishing cloth 16 to wash a polished surface of the wafer 54, thereby washing slurry away from the wafer 54. <P>COPYRIGHT: (C)2003,JPO |
