CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A chip package and a method for manufacturing the same are provided to be capable of minimizing the size of the chip package, and simplifying manufacturing processes. CONSTITUTION: A chip package(40) is provided with a chip(35) and a substrate(31) located at the lower portion of the chip. The chip includes the first surface having the first terminal, the second surface having the second terminal, the first and second conductive layer(35a,35b) formed on the first and second surface of the chip, respectively. The substrate includes a via hole(33) connected with the second terminal. Preferably, a resin molding part(39) is formed along the peripheral portion of the chip. Preferably, the third and fourth conductive layer(31a,31b) are formed on both surface of the substrate and the conductive layers are connected with each other through the via hole.