发明名称 BONDING APPARATUS
摘要 A bonding apparatus that includes a bonding tool through which a wire passes and which performs bonding on a workpiece, a position detection camera which takes images of the workpiece, a reference member which is disposed in a specified position, and an optical assembly which conducts the image of the tool and reference member to the position detection camera. A lens used in the position detection camera and a lens installed in the optical assembly are arranged so that such lenses construct an afocal optical system.
申请公布号 KR20030057322(A) 申请公布日期 2003.07.04
申请号 KR20020081622 申请日期 2002.12.20
申请人 发明人
分类号 H01L21/60;G03B17/00 主分类号 H01L21/60
代理机构 代理人
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