| 摘要 |
<p>PURPOSE: A semiconductor package is provided to be capable of increasing the mounting density of the package by vertically mounting a plurality of semiconductor chip at the package and improving the characteristic of heat release by exposing a considerable region of the semiconductor chip to the outside. CONSTITUTION: A substrate(10) is provided with a plurality of grooves(15), a conductive via hole(11) formed at one sidewall of each groove, a plurality of conductive wiring patterns(13) connected with the via holes, and a plating lead(14) formed at each conductive wiring pattern. A semiconductor package(100) is provided with the substrate, a plurality of semiconductor chips(20) having bonding pads(21) vertically inserted into each groove and electrically connected with each conductive via hole, and a molding part(40) filled in the grooves for protecting the semiconductor chips.</p> |
