| 摘要 |
PURPOSE: A method for manufacturing a stacked chip package is provided to be capable of easily stacking semiconductor chips having same size by forming bonding pads at center portions. CONSTITUTION: The first stacked chip(210) is attached on the first substrate(200). The second stacked chip(310) is attached on the second substrate(300). The second substrate(300) including the second stacked chip is bonded on the first stacked chip(210) of the first substrate. At the time, bonding pads of the first and second stacked chip(210,310) are formed at center portions of the first and second stacked chip. The first substrate(200) is connected to the second substrate(300) by a metal pattern(402).
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