发明名称 |
EXPOSURE EQUIPMENT FOR LEAD FRAME PRINTED CIRCUIT BOARD |
摘要 |
PURPOSE: An exposure equipment is provided to improve an exposure quality by making a surface of a lead frame substrate be leveled and to minimize consumed lead frame substrate by minimizing a gap between exposure regions of an exposed lead frame substrate. CONSTITUTION: A roller part shifts a lead frame substrate into a region which is exposed by an ultraviolet light source. A mask carrier(5) is configured to mount a film where a pattern to be printed on a substrate is printed. The mask carrier is mounted on a frame(3), and a camera part receives an image signal for aligning the substrate and a film. A mark generator(10) exists at a film placed on the substrate or a film placed at a lower part of the substrate. A substrate alignment mark(12) is produced at a lead frame substrate(9) region placed at the mark generator at exposing. A boundary between an exposed substrate region and a substrate region to be exposed is divided by the substrate alignment mark.
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申请公布号 |
KR20030055837(A) |
申请公布日期 |
2003.07.04 |
申请号 |
KR20010085941 |
申请日期 |
2001.12.27 |
申请人 |
HANMAC CORPORATION |
发明人 |
CHO, JEONG WON;CHOI, JONG BAE;KIM, SU GIL;YOON, CHUNG EUN;YOON, HO YEONG |
分类号 |
H05K3/00;(IPC1-7):H05K3/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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