METHOD OF MANUFACTURING HIGH CONDUCTIVE WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which can obtain remarkably high connection reliability even if high density wiring is formed in a limited area, and to provide a manufacturing method of the wiring board. SOLUTION: The method has a process for arranging two of more cover films on the upper face of an insulating base material where a base material holding material is disposed on a base, and making a blind via hole where the base material holding material is made the base; a process for filling the blind via hole with paste containing conductive particles and a binder component which is placed on the surface of the insulating base material by using a squeegee, a process for peeling the first cover film on an outermost layer and making paste protrude, and a process for arranging an absorbing sheet on the surface of a second cover film and absorbing a part of the binder component of paste by the absorbing sheet so as to increase the content of the conductive particles in paste. COPYRIGHT: (C)2003,JPO