METHOD FOR BONDING FLIP CHIP OF LASER DIODE

摘要

PURPOSE: A method for bonding a flip chip of a laser diode is provided, which solidifies the bonding between the laser diode and a circuit part, and suppresses a product error rate. CONSTITUTION: According to the flip chip bonding method bonding a laser diode(21) and a circuit part(27), a plating layer(23) is formed using a photo resist pattern formed on the laser diode. The second solder(29a) of a metallic material is formed on the plating layer. An anti-reflective coating(25) is formed on a light signal emission plane of the laser diode, and the above photo resist is removed. Then, the circuit part and the laser diode are bonded each other by reflowing the first solder(29b) and the second solder formed on the circuit part.