BAKE APPARATUS FOR SEMICONDUCTOR PHOTO PROCESS

摘要

PURPOSE: A bake apparatus for semiconductor photo process is provided to transfer uniformly the heat to a wafer by installing a plurality of proximity balls at an outer circumference of a hot plate to the height of the hot plate. CONSTITUTION: A bake apparatus for semiconductor photo process includes a hot plate(200). The hot plate is used for loading a wafer and transferring the heat to the wafer. The hot plate includes three or more proximity balls(210). The proximity balls are used for handling the height of the hot plate. The bake apparatus is used for performing a bake process for the wafer having the warpage in a metal process of a fabrication process. The proximity balls are installed within 1 cm from an outer circumference of the hot plate.