| 摘要 |
PURPOSE: A heat dissipation structure off a speaker system for amp attachment is provided, which improves heat dissipation characteristics and maximizes a speaker system inner volume. CONSTITUTION: The speaker system includes a cabinet(1), a speaker, a PCB assembly(5), a heat dissipating plate(4) and an amp case. The speaker system comprises a sub heat dissipating plate(120) inserted in a vertical direction in the back of the cabinet. The sub heat dissipating plate has a connection hole to be connected with a bolt connection projection(130) formed in the amp case through a bolt, and contacts with the heat dissipation plate while being connected with the bolt connection projection by the bolt.
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