发明名称 MATERIAL AND METHOD FOR FORMING CONDUCTIVE PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a material and method for forming conductive pattern by which a fine disconnection-free conductive pattern can be formed with high sensitivity and high resolution through exposure and, in addition, a pattern can be formed directly with an infrared laser beam based on digital data. SOLUTION: After a hydrophilic pattern is formed on the surface of a substrate in a state where the pattern is directly coupled with the surface, a conductive polymer layer is formed on the pattern. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003188498(A) 申请公布日期 2003.07.04
申请号 JP20010386491 申请日期 2001.12.19
申请人 FUJI PHOTO FILM CO LTD 发明人 KAWAMURA KOICHI;KANO TAKEYOSHI
分类号 G03F7/40;H01B13/00;H01L21/027;H01L21/288;H01L23/14;H05K3/10;(IPC1-7):H05K3/10 主分类号 G03F7/40
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