| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a two-layer metallized polyimide substrate having sufficient insulation reliability even when fine wiring is formed on the substrate. SOLUTION: In a printed wiring board, a pattern is formed by etching a metal-coated polyimide film formed on one or both surfaces of a polyimide resin film by a dry film forming method and having a first metallic layer composed of Ni, Cu, Mo, Ta, Ti, V, Cr, Fe, Co, and their alloys and a second metallic layer formed on the first metallic layer by electroplating or electroless plating and having conductivity. After etching, the etched surface is oxidized with at least one kind of oxidizing agent selected from among potassium permanganate, potassium dichromate, and hydrogen peroxide. COPYRIGHT: (C)2003,JPO
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