| 摘要 |
PURPOSE: A die bonding apparatus using a screen jet method is provided to be capable of preventing the loss of working time due to a nozzle and the loss of parts and improving attach efficiency by directly jetting epoxy at the lower portion of a chip. CONSTITUTION: A die bonding apparatus is provided with a transfer part installed for transferring a semiconductor chip of a wafer to an epoxy printed lead frame, an epoxy supply part capable of moving to and fro installed for supplying epoxy, and an epoxy passing part. The epoxy supply part includes a screen film(42) having a plurality of epoxy screen holes, a screen film roller installed at both sides of the screen film, and a driving gear(48) installed in the screen film roller for driving the screen film roller to forward and reverse direction.
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