MOLD CAVITY BAR FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A mold cavity bar for manufacturing a semiconductor package is provided to be capable of reducing cost by replacing the damaged part alone of the cavity bar instead of replacing the entire cavity bar when the cavity bar is partially damaged. CONSTITUTION: A mold cavity bar(10) for manufacturing a semiconductor package is provided with a rectangular plate type block(1), a connecting recess portion(2) having a predetermined space formed and spaced apart from the block, and a cavity unit(7). The cavity unit includes a cavity(4) capable of being attached and detached at the connecting recess portion, a rectangular line type matte(3) filled in the inner portion of the cavity, and a gate(5) capable of flowing molding compound into the inner portion of the cavity. Preferably, the cavity unit is connected to the block by using at least two screws(6).