发明名称 Solder paste
摘要 A lead-free solder paste comprises an Sn-Zn based lead-free solder powder mixed with a flux. The flux contains at least one aromatic hydroxycarboxylic acid selected from the group consisting of aromatic carboxylic acids having one hydroxyl group in a meta position (such as 3-hydroxy-2-methylbenzoic acid) and aromatic carboxylic acids having at least two hydroxyl groups (such as dihydroxynaphthoic acid or dihydroxybenzoic acid) in an amount of 0.1-10.0 mass %. The flux may further include 0.5-20 mass % of an aliphatic hydroxy carboxylic acid (such as hydroxyoleic acid).
申请公布号 US2003121564(A1) 申请公布日期 2003.07.03
申请号 US20020308167 申请日期 2002.12.03
申请人 TAGUCHI TOSHIHIKO;TAKAURA KUNIHITO;HIRATA MASAHIKO;YOSHIDA HISAHIKO;NAGASHIMA TAKASHI 发明人 TAGUCHI TOSHIHIKO;TAKAURA KUNIHITO;HIRATA MASAHIKO;YOSHIDA HISAHIKO;NAGASHIMA TAKASHI
分类号 B23K35/363;B23K35/02;B23K35/26;B23K35/36;C22C13/00;H05K3/34;(IPC1-7):B23K35/34 主分类号 B23K35/363
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