发明名称 |
Solder paste |
摘要 |
A lead-free solder paste comprises an Sn-Zn based lead-free solder powder mixed with a flux. The flux contains at least one aromatic hydroxycarboxylic acid selected from the group consisting of aromatic carboxylic acids having one hydroxyl group in a meta position (such as 3-hydroxy-2-methylbenzoic acid) and aromatic carboxylic acids having at least two hydroxyl groups (such as dihydroxynaphthoic acid or dihydroxybenzoic acid) in an amount of 0.1-10.0 mass %. The flux may further include 0.5-20 mass % of an aliphatic hydroxy carboxylic acid (such as hydroxyoleic acid).
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申请公布号 |
US2003121564(A1) |
申请公布日期 |
2003.07.03 |
申请号 |
US20020308167 |
申请日期 |
2002.12.03 |
申请人 |
TAGUCHI TOSHIHIKO;TAKAURA KUNIHITO;HIRATA MASAHIKO;YOSHIDA HISAHIKO;NAGASHIMA TAKASHI |
发明人 |
TAGUCHI TOSHIHIKO;TAKAURA KUNIHITO;HIRATA MASAHIKO;YOSHIDA HISAHIKO;NAGASHIMA TAKASHI |
分类号 |
B23K35/363;B23K35/02;B23K35/26;B23K35/36;C22C13/00;H05K3/34;(IPC1-7):B23K35/34 |
主分类号 |
B23K35/363 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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