发明名称 |
Semiconductor device formed in semiconductor layer arranged on substrate with one of insulating film and cavity interposed between the substrate and the semiconductor layer |
摘要 |
A semiconductor device according to an aspect of the present invention comprises a first semiconductor layer and a plurality of second semiconductor layers. The first semiconductor layer is formed in a first region of a semiconductor substrate with one of an insulating film and a cavity interposed between the semiconductor substrate and the first semiconductor layer. The plurality of second semiconductor layers is formed in second regions of the semiconductor substrate. |
申请公布号 |
US2003122191(A1) |
申请公布日期 |
2003.07.03 |
申请号 |
US20020091448 |
申请日期 |
2002.03.07 |
申请人 |
NAGANO HAJIME;MIZUSHIMA ICHIRO;YAMADA TAKASHI;UDO YUSO;NITTA SHINICHI |
发明人 |
NAGANO HAJIME;MIZUSHIMA ICHIRO;YAMADA TAKASHI;UDO YUSO;NITTA SHINICHI |
分类号 |
H01L21/762;H01L27/12;(IPC1-7):H01L27/01 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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