发明名称 Semiconductor device formed in semiconductor layer arranged on substrate with one of insulating film and cavity interposed between the substrate and the semiconductor layer
摘要 A semiconductor device according to an aspect of the present invention comprises a first semiconductor layer and a plurality of second semiconductor layers. The first semiconductor layer is formed in a first region of a semiconductor substrate with one of an insulating film and a cavity interposed between the semiconductor substrate and the first semiconductor layer. The plurality of second semiconductor layers is formed in second regions of the semiconductor substrate.
申请公布号 US2003122191(A1) 申请公布日期 2003.07.03
申请号 US20020091448 申请日期 2002.03.07
申请人 NAGANO HAJIME;MIZUSHIMA ICHIRO;YAMADA TAKASHI;UDO YUSO;NITTA SHINICHI 发明人 NAGANO HAJIME;MIZUSHIMA ICHIRO;YAMADA TAKASHI;UDO YUSO;NITTA SHINICHI
分类号 H01L21/762;H01L27/12;(IPC1-7):H01L27/01 主分类号 H01L21/762
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