GEL-FREE COLLOIDAL ABRASIVE POLISHING COMPOSITION AND ASSOCIATED METHOD

摘要

PROBLEM TO BE SOLVED: To provide a polishing composition of a gel-free colloidal polishing material an a polishing method associated with the same material, (e.g. a chemical-mechanical planarization).

SOLUTION: This polishing composition is constituted by a surface-modified colloidal abrasive modified with a boron-containing compound, e.g. a colloidal ceria or silica of which surface is modified by boron. The composition is useful in the chemical-mechanical planarization (CMP) use and also in a polishing use of a base substrate. The polishing composition is in most cases a negatively charged colloid and stays as the stable negatively-charged colloid even in an acidic medium.

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