发明名称 |
Dual interposer packaging for high density interconnect |
摘要 |
A method and apparatus that allows additional contact pads to be added to a package to support debug and test operations is disclosed. In a preferred embodiment, a circuit board apparatus includes a semiconductor package and an interposer for receiving the semiconductor package. The semiconductor package preferably includes a substrate having a matrix of conductive contact pads on both the top and bottom surfaces of the substrate. The interposer preferably includes a body having a matrix of interposer contact bumps on both the inner and outer surfaces of the body. Each interposer contact bump preferably includes a metal coating and is shaped to abut a contact pad of the semiconductor package.
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申请公布号 |
US2003123231(A1) |
申请公布日期 |
2003.07.03 |
申请号 |
US20010033990 |
申请日期 |
2001.12.28 |
申请人 |
SHAH SHARAD M.;BACH DAVID R.;VILLANI ANGELO;PALMER NICHOLAS |
发明人 |
SHAH SHARAD M.;BACH DAVID R.;VILLANI ANGELO;PALMER NICHOLAS |
分类号 |
G01R31/28;H05K7/10;(IPC1-7):H05K7/02 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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