| 发明名称 |
Flip-chip opto-electronic circuit |
| 摘要 |
A thermo-optic switch comprises two planar waveguide and a heating element couple to at least one of the planar waveguides. The heating element is coupled to a package substrate using solder bumps.
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| 申请公布号 |
US2003122263(A1) |
申请公布日期 |
2003.07.03 |
| 申请号 |
US20010033590 |
申请日期 |
2001.12.27 |
| 申请人 |
SU JUN |
发明人 |
SU JUN |
| 分类号 |
G02B6/42;G02F1/01;G02F1/313;H05K1/02;(IPC1-7):H01L23/48 |
主分类号 |
G02B6/42 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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