发明名称 HEATED FILLING DEVICE AND METHOD
摘要 A filling system includes a pressurized source of fill material (11A) and a pressure fill head (10) wherein the fill head (12) also includes a heating element (13) positioned so as to transfer heat to fill material (11A) passing through the fill head (12). A method of filling holes using a fill material passing through a pressure fill head (10) includes the steps of causing fill material (11A) to enter the fill head (12), modifying the viscosity of the fill material (11A) while it is with in the fill head (12), and causing the modified viscosity fill material (11A) to exit the fill head (12) and enter at least one hole.
申请公布号 WO03053623(A1) 申请公布日期 2003.07.03
申请号 WO2002US40364 申请日期 2002.12.17
申请人 HONEYWELL ADVANCED CIRCUITS, INC.;PEDIGO, JESSE;MEYER, TIMOTHY 发明人 PEDIGO, JESSE;MEYER, TIMOTHY
分类号 H05K3/00;H05K3/40;(IPC1-7):B23K1/00;B23K31/02;B67D5/62;B22D39/00 主分类号 H05K3/00
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