| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate, which prevents formation of a plated layer on a needless part, and can form a fine pattern, namely a clearer pattern of a circuit. SOLUTION: This method for manufacturing the substrate comprises the first step of forming insulative protection coating films 14 and 15, on both the surfaces of a substrate body of the substrate 13 which has metal layers 11 and 12 on both the entire surfaces of an insulative substrate 10, the second step of forming an open hole 16 of a through hole at a predetermined position of the substrate body of the substrate 13 on which the insulative protection coating films 14 and 15 have been formed, the third step of electrolytically plating the inside of the open hole 16 after forming a conductive film 21 in the open hole 16, and the fourth step of peeling the insulative protection coating films 14 and 15. The above conductive film 21 may be formed, for instance, by an electrostatic spray coating which uses negatively charged fine particles of carbon, or by electroless plating. COPYRIGHT: (C)2003,JPO
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