发明名称 Wafer support and peripheral parts thereof
摘要 A wafer support and peripheral parts thereof are used in a heating apparatus for semiconductor wafers and are made of a silicon nitride-silicon carbide ceramic composite containing 5 to 30 weight % silicon carbide. The wafer support and peripheral parts have superior crack healing characteristic in addition to superior thermal resistance, thermal shock resistance, and chemical stability.
申请公布号 US2003121475(A1) 申请公布日期 2003.07.03
申请号 US20020310998 申请日期 2002.12.06
申请人 CHU MIN-CHEOL;ANDO KOTOJI;SATOH SHIGEMI;SAITOH SHINJI 发明人 CHU MIN-CHEOL;ANDO KOTOJI;SATOH SHIGEMI;SAITOH SHINJI
分类号 C04B35/584;H01L21/00;H01L21/26;H01L21/324;H01L21/683;H01L21/687;(IPC1-7):C23C16/00 主分类号 C04B35/584
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