| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting anisotropic electroconductive adhesive having heat resistance and moisture resistance which have not been obtained by a conventional anisotropic adhesive and having small curing shrinkage in thermosetting reaction and excellent adhesion to various adherends. SOLUTION: This anisotropic electroconductive adhesive is obtained by dispersing electroconductive particles into an insulating adhesive consisting essentially of a phenoxy resin having 10,000 to 100,000 molecular weight, an epoxy resin, a silane coupling agent and a microencapsulated imidazole derivative epoxy compound. COPYRIGHT: (C)2003,JPO
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