Semiconductor device, packaging method thereof, and package product thereof

摘要

A semiconductor device includes: a circuit constituting section having (a) a function circuit and (b) an externally-drawing electrode, connected to the function circuit, on a surface of the circuit constituting section; and an insulating layer provided on a side of a rear surface of the circuit constituting section, wherein the insulating layer has a face opposite to the circuit constituting section, and an area of the face is set so as to be larger than an area of the rear surface of the circuit constituting section. Thus, it is possible to clear such problems that an adhesive that has overflowed from a space between the semiconductor device and the circuit substrate adheres to a bonding collet when flip chip bonding is performed.