Lead frame with dual thin film coated on inner lead terminal

摘要

The present invention provides a lead frame structure for semiconductor package comprising a main frame, a die paddle located the central portion of the lead frame structure for locating a die thereon. A die pad supporting bar is connected to the main frame to support the die paddle, a plurality of outer leads is connected to the main frame and a plurality of inner leads surrounds the die paddle and connected to the outer lead. Wherein the terminal portion of the inner leads with dual thin layer structure includes a first conductive layer and a second conductive layer including gold to improve the bonding wire reliability.