发明名称 Optical module, circuit board and electronic device
摘要 An optical chip having an optical section and an electrode is formed above a substrate. The optical chip is surrounded by a body. The optical section is sealed by a first seal section. An electrical connection portion between the electrode of the optical chip and an interconnecting line of the substrate is sealed by a second seal section.
申请公布号 US2003124773(A1) 申请公布日期 2003.07.03
申请号 US20020292372 申请日期 2002.11.12
申请人 SEIKO EPSON CORPORATION 发明人 HASHIMOTO NOBUAKI
分类号 H01L27/14;H01L23/10;H01L27/146;H01L31/02;H01L31/0203;H01L31/0216;H01L31/0232;H04N5/225;H04N5/335;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 主分类号 H01L27/14
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