| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a negative photosensitive polyimide resin composition giving a polyimide film which can adhere again after curing like a general thermoplastic resin and excellent in pattern forming property and to provide a method for producing a semiconductor device using the composition. <P>SOLUTION: The photosensitive resin composition comprises a solvent containing (A) a polyimide precursor of formula (1) (where R<SP>2</SP>comprises a divalent aromatic organic group and an organic group of formula (2), wherein the proportion of the organic group of formula (2) to the whole R<SP>2</SP>is 10 to 50 mol%), (B) a photopolymerization initiator, a sensitizer and a polymerization inhibitor and (C) a photosensitive agent. In the method for producing a semiconductor device, a semiconductor chip (1, 5) is coated with the composition, the composition is patterned to form a polyimide surface protective film (4, 7), and a semiconductor chip (2, 6) is fixed on the film (4, 7) by hot pressing. <P>COPYRIGHT: (C)2003,JPO |
