| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a tiling method, a tiling exposure mask and a method for producing a multi-layer wiring board by using them in which intra-plane pattern densities on the front side and the rear side of a tiling substrate can be made uniform and the number of the exposure masks to be used can be decreased when producing the multi-layer wiring board by tiling. <P>SOLUTION: In the x-axis (lateral) direction and the y-axis (longitudinal) direction of the tiling substrate, the front multi-layer wiring board and the rear multi-layer wiring board are each alternately located, the even number of boards are located in the x-axis (lateral) direction, the tiling exposure mask is produced by arranging arranged individual front and rear mask patterns for multi-layer wiring boards on a transparent substrate, and the multi-layer wiring board is produced on the tiling substrate by using the tiling exposure mask. <P>COPYRIGHT: (C)2003,JPO</p> |
