| 摘要 |
The present invention discloses a ball grid array package. The ball grid array package of the present invention comprises a substrate and at least one chip, and the substrate has a plurality of ball pads. The present invention disposes a plurality of testing pads having openings on the substrate, and the ball pads are electrically connected to the testing pads. By the structure, a probe of a testing socket can contact with the testing pads, and keep the shape of the ball pads complete. |
