发明名称 |
PRETREATMENT PROCESS OF ELECTROLESS PLATING MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To form a plated film showing an excellent adhesion, without subjecting a resin material to surface roughening. SOLUTION: The resin material having an unsaturated bond is brought into contact with an ozone-containing solution to perform ozone treatment. The surface of the ozone-treated resin material is stabilized through stabilizing treatment and subsequently subjected to electroless plating. It is considered that the stabilizing treatment decomposes unstable ozonides at the surface of the resin material and generates methylol or carbonyl groups. Therefore, the plated film exerts a high adhesion immediately after electroless plating. COPYRIGHT: (C)2003,JPO
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申请公布号 |
JP2003183841(A) |
申请公布日期 |
2003.07.03 |
申请号 |
JP20010382025 |
申请日期 |
2001.12.14 |
申请人 |
TOYOTA MOTOR CORP;KANTO KASEI KOGYO KK |
发明人 |
NAKANISHI MASAJI;BESSHO TAKESHI;SUZUKI SHIGERU |
分类号 |
C23C18/28;(IPC1-7):C23C18/28 |
主分类号 |
C23C18/28 |
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