| 摘要 |
PROBLEM TO BE SOLVED: To provide a partial plating process which may greatly improve the reliability of a sealed electronic structure product and realizes a high mountability and sealability/weldability, and an electronic component obtained by using this process. SOLUTION: In the partial plating process, an electric current with a polarity opposite to that of a plating solution is applied to a plate-form metal (II) to perform partial electroless plating of the metal plate (II). Here, the metal plate (II) is positioned on at least one of the principal surfaces of another metal plate (I) via an insulating layer. COPYRIGHT: (C)2003,JPO
|
