发明名称 |
Solder reflow with microwave energy |
摘要 |
The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.
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申请公布号 |
US2003121958(A1) |
申请公布日期 |
2003.07.03 |
申请号 |
US20010041012 |
申请日期 |
2001.12.28 |
申请人 |
RATIFICAR GLENN;GONZALEZ CARLOS;WANG LEJUN |
发明人 |
RATIFICAR GLENN;GONZALEZ CARLOS;WANG LEJUN |
分类号 |
B23K1/008;H05K3/34;(IPC1-7):B23K1/20;B23K31/02 |
主分类号 |
B23K1/008 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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