| 摘要 |
PROBLEM TO BE SOLVED: To provide an etchant for optionally setting dissolution rates for two different metals, and a method for manufacturing a circuit board therewith. SOLUTION: The etchant includes monovalent copper ions, divalent copper ions, and hydrochloric acid, wherein the mole fraction of the monovalent copper ions to the total copper ions is 0.1 or more, and the monovalent copper ions have the saturated concentration thereof or lower. COPYRIGHT: (C)2003,JPO
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