发明名称 MAGNETRON SPUTTERING METHOD WITH MULTIPLEX MAGNETIC POLES
摘要 PROBLEM TO BE SOLVED: To improve the life of a target and the utilization efficiency in a magnetron sputtering method. SOLUTION: This magnetron sputtering method comprises forming a magnetic field P formed on a front face 7a of a tabular target 7 by magnetic-field- generating means 1 and 2 arranged in a back face 7b of the target to form an erosion region, sputtering the target with plasma generated in the erosion region, and making the generated sputtered particles reach a substrate 8 arranged so as to face with the target 7 and form a thin film 8a. A magnetron sputtering apparatus radially has several supplemental magnetic-field-generating means 3 which have the magnetic poles having different polarities from those of the back central magnetic poles 1a, so as to direct toward the center of the target 7 in the circumferential outer side of the sputtering side 7a of the target 7. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003183828(A) 申请公布日期 2003.07.03
申请号 JP20010381945 申请日期 2001.12.14
申请人 ASAHI SEISAKUSHO:KK 发明人 KAWABATA TAKASHI;KAJIOKA HIDE;WATABE YOSHISATO;FUJII SHUITSU
分类号 C23C14/35;G11B5/851;(IPC1-7):C23C14/35 主分类号 C23C14/35
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