发明名称 Semiconductor device and fabricating method for the same
摘要 The present invention is intended to provide a semiconductor device having a gate electrode free from increasing of resistance of the gate electrode, from decreasing of capacitance of the insulation film due to depletion, and from penetrating of impurity. The semiconductor device comprises a silicon layer, a gate insulating film formed on the silicon layer, a metal boron compound layer formed on the gate insulating film, and a gate electrode formed on the metal boron compound layer and containing at least silicon.
申请公布号 US2003122199(A1) 申请公布日期 2003.07.03
申请号 US20020321634 申请日期 2002.12.18
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KOYAMA MASATO;NISHIYAMA AKIRA
分类号 H01L29/43;H01L21/28;H01L21/336;H01L21/8238;H01L27/092;H01L29/423;H01L29/49;H01L29/78;(IPC1-7):H01L29/76;H01L29/94;H01L31/062 主分类号 H01L29/43
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