| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in curability and preservability, and a semiconductor using the composition. SOLUTION: The thermosetting resin composition comprises a thermosetting resin (A), and a substituted or unsubstituted vinylpyridine polymer or derivative thereof (B) or a substituted or unsubstituted vinylpyridine copolymer with another reactive monomer or a derivative thereof (C) as essential components. The semiconductor is sealed by the thermosetting resin compositions. COPYRIGHT: (C)2003,JPO
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