发明名称 Sound-damping laminate system
摘要 For loudspeaker components with flat and/or curved panel-like regions that require hard surfaces along with sound-damping properties to minimize sound feed-through and resonances, a three-layer laminate is formed from two surface layers of commercially available thermosetting molding compound, co-molded in a single molding operation with an embedded core of suitable sound damping material such as filled vinyl copolymer compound or filled silicon rubber compound. The core region is dimensioned to leave a peripheral margin in which the two layers of molding material become bonded together so as to fully encapsulate and seal the sound-damping core. Furthermore, the margin can be made to have any desired size, thickness or shape to also serve as a mounting, fastening or other function of the component.
申请公布号 US2003123688(A1) 申请公布日期 2003.07.03
申请号 US20000521522 申请日期 2000.03.08
申请人 COX DAVID H;WERNER BERNARD M;GELOW WILLIAM J 发明人 COX DAVID H;WERNER BERNARD M;GELOW WILLIAM J
分类号 H04R1/28;(IPC1-7):H04R1/02;H04R1/20 主分类号 H04R1/28
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