Desolder apparatus

摘要

Apparatus and methods for removing solder ball connections from electrical circuits are disclosed. The apparatus and methods comprise a solder ball removing tool 20 having a multiplicity of raised ribs 22 defining a contact surface 24 and made up of heat conductive material having a melting point above the melting point of solder. There is also included a heating source 30 for heating at least a portion of the multiplicity of raised ribs 22 to a temperature sufficient to melt the solder and yet below the melting temperature of the conductive material. The tool 20 is preferably supported or constructed such that the contact surface is tilted so that the melted solder will run down the raised ribs into a collecting pan 46.